1

Single and double sided SMT/PTH

Yes

2

Large parts on both sides, BGA on both sides

Yes

3

Smallest Chips size

0201

4

Min BGA and Micro BGA pitch and ball counts

0.008 in. (0.2mm) pitch, ball count greater than 1000

5

Min Leaded parts pitch

0.008 in. (0.2 mm)

6

Max Parts size assembly by machine

2.2 in. x 2.2 in. x 0.6 in.

7

Assembly surface mount connectors

Yes

8

Odd form parts:
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets

Yes

9

Wave soldering

Yes

10

Max PCB size

14.5 in. x 19.5 in.

11

Min PCB Thickness

0.02

12

Fiducial Marks

Preferred but not required

13

PCB Finish:

1．SMOBC/HASL
2．Electrolytic gold
3．Electroless gold
4．Electroless silver
5．Immersion gold
6．Immersion tin
7．OSP

14

PCB Shape

Any

15

Panelized PCB

1．Tab routed
2．Breakaway tabs
3．V-Scored
4．Routed+ V scored

16

Inspection

1．X-ray analysis
2．Microscope to 20X

17

Rework

1．BGA removal and replacement station
2．SMT IR rework station
3．Thru-hole rework station

18

Min IC Pitch

0.2mm

19

solder paster printer

0.2mm

20

POP Manufacturing capability

POP *3F