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PCB Assembly Prototype

PCB Assembly Services

Low-Volume PCB Assembly

Turkey PCB Assembly

SMT Stencil

Product Package

Main Equipments

FAQs

PCB

PCB Capacity

Multilayer PCB

Flexible PCB

Rigid Flex PCB

Metal Core PCB

Ceramic PCB

HDI PCB

Rogers PCB

Heavy Copper PCB

Main Equipments

FAQs

Special Service

PCB Layout

PCBA reverse

IC Decipher

PCB Assembly Services

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Item

Capability


1

Single and double sided SMT/PTH

Yes

2

Large parts on both sides, BGA on both sides

Yes

3

Smallest Chips size

0201

4

Min BGA and Micro BGA pitch and ball counts

0.008 in. (0.2mm) pitch, ball count greater than 1000

5

Min Leaded parts pitch

0.008 in. (0.2 mm)

6

Max Parts size assembly by machine

2.2 in. x 2.2 in. x 0.6 in.

7

Assembly surface mount connectors

Yes

8

Odd form parts:
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets

Yes

9

Wave soldering

Yes

10

Max PCB size

14.5 in. x 19.5 in.

11

Min PCB Thickness

0.02

12

Fiducial Marks

Preferred but not required

13

PCB Finish:

1.SMOBC/HASL
2.Electrolytic gold
3.Electroless gold
4.Electroless silver
5.Immersion gold
6.Immersion tin
7.OSP

14

PCB Shape

Any

15

Panelized PCB

1.Tab routed
2.Breakaway tabs
3.V-Scored
4.Routed+ V scored

16

Inspection

1.X-ray analysis
2.Microscope to 20X

17

Rework

1.BGA removal and replacement station
2.SMT IR rework station
3.Thru-hole rework station

18

Min IC Pitch

0.2mm

19

solder paster printer

0.2mm

20

POP Manufacturing capability

POP *3F