1

Layer

Flex board: 1-6Layers

Flex-Rigid Board: 2-8Layers

2

Material

CCL, PI, PET, PEN, FR-4

3

Final Thickness

Flex board: 0.002" - 0.1" (0.05-2.5mm)

Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm)

4

Surface Treatment

Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin

5

Min Trace

Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil

6

Min Width /Clearance

1oz: 5/5mil 1oz: 5/5mil

2oz: 5/7mil 2oz: 5/7mil

7

Min Hole Ring

Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil

1oz: 5mil 1oz: 5mil

2oz: 7mil 2oz: 7mil

8

Copper Thickness

1/3oz - 2oz

9

Max / Min Insulation Thickness

2mil/0.5mil (50μm/12.7μm)

10

Min Hole Size and Tolerance

Min hole: 8mil

Tolerance: PTH±3mil, NPTH±2mil

11

Min Slot

24mil x 35mil (0.6x0.9mm)

12

Solder Mask Alignment Tolerance

±3mil

13

Silkscreen Alignment Tolerance

±6mil

14

Silkscreen Line Width

5mil

15

Gold Plating

Nickel: 100μ" - 200μ" Gold: 1μ"-4μ"

16

Immersion Nickel / Gold

Nickel: 100μ" - 200μ" Gold: 1μ"-5μ"

17

Immersion Silver

Silver: 6μ" - 12μ"

18

OSP

Film: 8μ" - 20μ"

19

Test Voltage

Testing Fixture: 50-300V

20

Profile Tolerance of Punch

Accurate mould: ±2mil

Ordinary mould: ±4mil

Knife mould: ±8mil

Hand-Cut: ±15mil