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1-2012011A15A04.jpg

No.

Item

Mass Production

Prototype

1

Layers

1-8 Layers

1-20 Layers

2

Max. Panel Size

600*770mm( 23.62"*30.31")

600*770mm(23.62"*30.31")

500*1200mm(19.69"*47.24")

3

Max.Board Thickness

8.5mm

8.5mm

 4

 Min. Board Thickness

2L:0.3mm

2L:0.2mm



4L:0.4mm

4L:0.4mm



6L:0.8mm

6L:0.6mm

5

Min Inner Layer Clearance

0.1mm(4mil)

0.1mm(4mil)

6

Min Line width

0.1mm(4/4 mil)

0.075mm(3/3 mil)

7

Min Line space

0.1mm(4/4 mil)

0.075mm(3/3 mil)

8

Min.Hole Size

0.15mm(8mil)

0.1mm(6mil)

9

Min plated hole thickness

20um(0.8mil)

20um(0.8mil)

10

Min Blind/Buried hole size

0.2mm(8mil)

0.2mm(1-8layers)(8mil)

11

PTH Dia. Tolerance

±0.076mm(±3mil)

±0.076mm(±3mil)

12

Non PTH Dia. Tolerance

±0.05mm(±2mil)

±0.05mm(±2mil)

13

Hole Position Deviation

±0.05mm(±2mil)

±0.05mm(±2mil)

14

Heavy Coppe

4OZ/140μm

6OZ/175μm

15

Min S/M Pitch

0.1mm (4mil)

0.1mm (4mil)

16

Soldermask colour

Green,black,Blue,White,Yellow,Red

Green,black,Blue,White,Yellow,Red

17

Silkscreen colour

White,Yellow,Red,Black

White,Yellow,Red,Black

18

Outline

Routing,V-Groove, Beveling punch

Routing,V-Groove, Beveling punch

19

Outline Tolerance

±0.15mm ±6mil

±0.15mm (±6mil)

20

Peelable mask

Top,bottom,double sided

Top,bottom,double sided

21

Controlled Impedance

+/- 10%

+/- 7%

22

Insulation Resistance

1×1012Ω(Normal)

1×1012Ω(Normal)

23

Through Hole Resistance

<300Ω(Normal)

<300Ω(Normal)

24

Thermal Shock

3×10sec@288℃

3×10sec@288℃

25

Warp and Twist

≤0.7%

≤0.7%

26

Electric Strength

>1.3KV/mm

>1.4KV/mm

27

Peel Strength

1.4N/mm

1.4N/mm

28

Solder Mask Abrasion

>6H

>6H

29

Flammability

94V-0

94V-0

30

Test Voltage

50-330V

50-330V


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